Shenzhen Technology: HBM technology is still in the research and development stage and is not expected to generate related sales revenue and profits in the short term.
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Micron Technology is investing $9.3 billion to expand its advanced memory chip project, with HBM expected to ship in the second half of 2028.
PANews reported on July 5th that Micron Technology officially launched the expansion project of its Hiroshima plant in western Japan on Saturday (July 4th). This project, with a total investment of 1.5 trillion yen (approximately US$9.3 billion), aims to produce advanced memory chips, including high-bandwidth memory (HBM), to meet the booming demand driven by the artificial intelligence wave. HBM is a key component of Nvidia's AI processors, and the plant is expected to begin shipping around the summer of 2028. Recently, Micron, Samsung Electronics, and SK Hynix have all announced plans to expand their manufacturing capabilities. Earlier this week, SK Hynix announced plans to invest 80 trillion won (approximately US$51.46 billion) to build a new NAND memory chip factory in Cheongju, the capital of North Chungcheong Province, South Korea.
Montage Technology received research visits from multiple institutions and disclosed that MRDIMM will see large-scale production growth in the next two to three years.
According to Mars Finance, Montage Technology announced that from June 30th to July 2nd, 2026, the company conducted a targeted research activity through a combination of on-site meetings and conference calls. Regarding the MRDIMM and MRCD/MDB chip businesses, which have attracted market attention, Montage Technology stated that MRDIMM is a standardized high-bandwidth server memory module adapted to AI and high-performance computing scenarios, effectively solving the memory bandwidth bottleneck caused by AI inference. The industry is currently in the second-generation product large-scale trial stage, and large-scale industry-wide production is expected in the next two to three years. (Cailian Press)
JD Cloud establishes artificial intelligence technology research and development company
According to Mars Finance, JD.com (Suqian) Artificial Intelligence Technology R&D Co., Ltd. has been established, with a business scope including: retail of computer software and hardware and auxiliary equipment; information system integration services; data processing and storage support services, etc. Qichacha's equity penetration data shows that the company is wholly owned by JD Cloud Computing Co., Ltd. (Cailian Press)
Hangjin Technology: Net profit for the first half of the year is expected to increase by 191%-308% year-on-year; the intelligent computing power sector continues to perform well and has become the main source of profit.
According to Mars Finance, Hangjin Technology (2024111120230) announced that it expects its net profit attributable to shareholders of the listed company for the first half of 2026 to be between 40 million and 56 million yuan, representing a year-on-year increase of 191.45% to 308.03%. The performance change is mainly due to the continued positive development of the intelligent computing power segment, which has become the main source of profit, with an estimated profit of 137 million to 153 million yuan; the chemical segment is affected by declining sales prices, and is expected to incur a loss of 85 million to 100 million yuan. Note: The company's Q2 net profit is expected to be between 24 million and 40 million yuan, and Q1 net profit is 16 million yuan. Based on this, Q2 net profit is expected to change by 47% to 146% quarter-on-quarter. (Cailian Press)
Researchers have discovered two new types of superconductors using AI technology, offering new hope for the search of superconducting materials that can operate at room temperature.
According to Mars Finance, an international research team, including Aalto University in Finland, has discovered two new types of superconductors using artificial intelligence (AI), providing a new technological path for more efficient screening and development of superconducting materials. This achievement helps accelerate the development of new superconductors and brings new hope for finding superconducting materials that can operate at room temperature. The related research paper was recently published in the American academic journal *Physical Review Research*. The academic community generally believes that finding room-temperature superconducting materials that can be applied on a large scale will have a profound impact on energy utilization. If these materials can replace ordinary conductors in fields such as computers, data centers, and power transmission, they are expected to significantly reduce energy loss, reduce heat dissipation burden, and improve operating efficiency. (Cailian Press)
South Korean media: Samsung Electronics and SK Hynix may delay the introduction of next-generation HBM hybrid bonding technology.
According to Odaily Odaily, citing South Korean media reports, Samsung Electronics and SK Hynix are reassessing the timeline for adopting hybrid bonding technology in next-generation high-bandwidth memory (HBM). Due to a decrease in the demand for thickness reduction and improved heat dissipation performance in HBM, the market anticipates that the adoption of this technology may be further delayed than previously expected. Meanwhile, both companies are developing new heat dissipation solutions such as HPB and iHBM, respectively, and plan to apply them to HBM5 products. However, industry insiders believe that as the number of HBM I/Os continues to increase in the future, hybrid bonding will remain an important technology route in the medium to long term.