Amazon plans to raise at least $25 billion through a dollar bond issuance.
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Defu Technology: Plans to raise no more than 2.8 billion yuan through private placement for high-end electronic circuit AI copper foil project.
According to Mars Finance, Defu Technology (301511.SZ) announced that it plans to issue A-shares to specific targets, raising a total of no more than 2.8 billion yuan. After deducting issuance expenses, the funds will be used for the "50,000-ton AI copper foil project for high-end electronic circuits" and to supplement working capital. The AI copper foil project has a total investment of 2.25 billion yuan, with 1.98 billion yuan planned to be invested from the raised funds. It will be implemented by its wholly-owned subsidiary, Amber New Materials. Upon completion, the project will achieve an annual production capacity of 50,000 tons of high-end electronic circuit copper foil, including copper foil for FPCs, RTF, HVLP, and carrier copper foil, mainly used in AI servers, high-speed switches, optical modules, and other fields. This issuance is subject to approval by the company's shareholders' meeting, the Shenzhen Stock Exchange, and the China Securities Regulatory Commission. (Cailian Press)
Amazon Launches Eight-Part U.S. Investment Grade Bond Issuance
According to Mars Finance, on July 7, Amazon (AMZN) announced the launch of an eight-part U.S. investment-grade bond issuance.
Is the first humanoid robot company to go public on the A-share market coming? Unitree Robotics' IPO registration on the Science and Technology Innovation Board has been approved, with plans to raise 4.202 billion yuan.
According to Odaily Odaily on July 6, the Shanghai Stock Exchange website shows that the IPO application status of Unitree Technology Co., Ltd. on the Science and Technology Innovation Board has changed to "registration effective". It is reported that Unitree Robotics plans to issue no less than 40.4464 million new shares in its IPO, accounting for no less than 10% of the total share capital after the issuance, with a planned total fundraising amount of 4.202 billion yuan. According to the prospectus, from 2023 to 2025, the company's operating revenue was 159 million yuan, 393 million yuan, and 1.699 billion yuan, respectively, and its net profit was -11.1451 million yuan, 95.4747 million yuan, and 278 million yuan, respectively, making it one of the few profitable high-performance general-purpose robot companies globally. (Bianews)
Data center operator Csquare plans to raise up to $1.35 billion in a NYSE IPO.
According to filings with the U.S. Odaily(SEC), data center operator Csquare plans to list on the NYSE under the ticker symbol "CSQR." The company plans to issue 50 million shares at a price range of $23 to $27 per share, raising up to $1.35 billion. At the upper end of the offering price range, the company's valuation would be approximately $4.18 billion. This IPO comes at a time of global expansion in AI computing power and data centers, with market demand for infrastructure assets continuing to rise. (Bloomberg)
Jingce Electronics: Plans to acquire a portion of the equity of Shanghai Jingce and raise supporting funds; stock trading suspended.
According to Mars Finance, Jingce Electronics announced that it is planning to acquire a portion of the equity of its holding subsidiary, Shanghai Jingce Semiconductor Technology Co., Ltd., through a combination of share issuance, convertible bonds, and cash payment, and to raise supporting funds. This is expected to constitute a major asset restructuring and related-party transaction. Due to the uncertainty of the matter, the company's stock and convertible bonds (Jingce Convertible Bond 2) will be suspended from trading on July 9, 2026. The transaction plan is expected to be disclosed within 10 trading days.
India plans first tokenized bonds using wholesale CBDC: Report
India plans to test tokenized corporate bonds in a September pilot, with state-controlled REC issuing the debt and select investors using wholesale CBDC payments.