Samsung begins mass production of next-generation enterprise-grade SSDs for Nvidia Vera Rubin.
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South Korean media: Samsung Electronics and SK Hynix may delay the introduction of next-generation HBM hybrid bonding technology.
According to Odaily Odaily, citing South Korean media reports, Samsung Electronics and SK Hynix are reassessing the timeline for adopting hybrid bonding technology in next-generation high-bandwidth memory (HBM). Due to a decrease in the demand for thickness reduction and improved heat dissipation performance in HBM, the market anticipates that the adoption of this technology may be further delayed than previously expected. Meanwhile, both companies are developing new heat dissipation solutions such as HPB and iHBM, respectively, and plan to apply them to HBM5 products. However, industry insiders believe that as the number of HBM I/Os continues to increase in the future, hybrid bonding will remain an important technology route in the medium to long term.
Precision Technology: Single-joint exoskeleton robots have achieved mass production capability and have been launched on the market; the first-generation prototype of the multi-joint exoskeleton assistive robot has been completed.
Mars Finance reports that Jinggong Technology (002006.SZ) released an investor relations activity record announcement, stating that the company's exoskeleton assistive robot products include single-joint and multi-joint types. Among them, the single-joint (hip joint) exoskeleton robot has achieved mass production capability and has been launched on the market; the first-generation prototype of the multi-joint exoskeleton assistive robot has been completed and is currently undergoing performance testing and optimization. The company will continue to promote the research and development of multi-joint exoskeleton assistive robots to achieve the industrialization goal of diversified and serialized robot products. (Cailian Press)
Cisco unveils Nexus One, the next-generation data center architecture designed to reshape network infrastructure for AI.
PANews reported on July 5th that networking technology giant Cisco officially announced the launch of its data center network architecture, Cisco Nexus One. Positioned as an open network architecture for AI workloads and next-generation security threats, it upgrades Cisco's long-evolving ACI system. Cisco stated that Nexus One will integrate with Cisco's unified platform, Cisco Cloud Control, aiming to improve architectural flexibility, openness, and scalability while maintaining backward compatibility with existing systems. However, Nexus One is not a standalone product, but rather an "architectural evolution" similar to ACI, shifting its focus from early innovation to standardization and cross-ecosystem interoperability to adapt to the complex network needs of the AI/ML era.
Montage Technology received research visits from multiple institutions and disclosed that MRDIMM will see large-scale production growth in the next two to three years.
According to Mars Finance, Montage Technology announced that from June 30th to July 2nd, 2026, the company conducted a targeted research activity through a combination of on-site meetings and conference calls. Regarding the MRDIMM and MRCD/MDB chip businesses, which have attracted market attention, Montage Technology stated that MRDIMM is a standardized high-bandwidth server memory module adapted to AI and high-performance computing scenarios, effectively solving the memory bandwidth bottleneck caused by AI inference. The industry is currently in the second-generation product large-scale trial stage, and large-scale industry-wide production is expected in the next two to three years. (Cailian Press)
Samsung's foundry business is expected to secure orders from Meta and Anthropic, and is projected to return to profitability in the fourth quarter.
According to ChainCatcher, South Korean media reports that Samsung Electronics' foundry business is accelerating its expansion in the global AI chip market. Following its AI chip order from Tesla last year, Samsung is currently advancing its custom ASIC production collaboration with Meta and Anthropic. Meta is reportedly in talks with Samsung for a next-generation ASIC design and manufacturing contract worth over 10 trillion won. Meta's third-generation AI accelerator, "MTIA," plans to switch from TSMC to Samsung's most advanced 2nm process for mass production, with early chip architecture design handled jointly by Samsung's System LSI division to match its rapid development cycle of one generation every six months. Furthermore, US AI company Anthropic is also evaluating the use of Samsung's 2nm process to develop custom ASICs, aiming to internalize its AI infrastructure. Industry insiders point out that with the influx of AI chip orders from global tech giants, coupled with the ongoing negotiations with BYD for an automotive chip manufacturing agreement, Samsung's medium- to long-term order backlog for its wafer foundry business is expected to approach 50 trillion won, and it is expected to achieve a turnaround in operating profit in the fourth quarter of this year.
Bitwise CIO: The crypto industry may become part of the next generation of economic rule-making.
Odaily Odaily reports that Bitwise Chief Investment Officer Matt Hougan posted on the X platform that he recently read a speech by U.S. Treasury Secretary Bessenter, calling it "an important document that defines America's economic role for the next century." He pointed out that in his speech, Bessant outlined five principles for the future US economic strategy, the third of which was: "The United States will set the rules for the next generation of the economy." When discussing the digital economy, Bessant stated, "Digital assets, stablecoins, tokenization, and new payment systems will help shape the future of money. The United States should not place itself as a bystander in building this future." Matt Hougan commented that this statement demonstrates the US government's emphasis on promoting the development of the crypto industry and reflects the fact that digital assets are being incorporated into an important part of the future financial system and economic competitive landscape.