Shanghai Electric Group: Early participation in the electrical performance verification and reliability testing of next-generation high-end materials shortens the material certification cycle and ensures priority quota guarantees during periods of supply shortage.

According to Mars Finance, Shanghai Electric Group Co., Ltd. (002463.SZ) released an investor relations activity record announcement. Domestically, the company balances short-term benefits with long-term development. On the one hand, it focuses on bottlenecks and key processes in high-end PCBs, implementing iterative upgrades and targeted capacity expansion, continuously tapping the high-value-added output potential of existing plants. On the other hand, it accelerates the construction of high-end capacity expansion projects. The company's planned investment of approximately 4.3 billion RMB in Q4 2024 to build a new high-end printed circuit board expansion project for artificial intelligence chips commenced construction in late June 2025 and is currently progressing smoothly. Trial production is expected to begin in the second half of 2026, gradually increasing capacity. The implementation of this project will further expand the company's high-end product capacity and better meet customers' medium- and long-term demand for high-end printed circuit boards for emerging computing scenarios such as high-speed computing servers and artificial intelligence, enhancing the company's core competitiveness and improving its economic benefits. Based on its forecast of market demand and structure, the company accelerated the launch of a series of capacity expansion plans in the first quarter of 2026. In June 2026, the company acquired 100% equity of Kunshan Pujiang Warehousing Facilities Co., Ltd. (hereinafter referred to as "Pujiang Warehousing"), and will use Pujiang Warehousing's factory buildings for capacity expansion. To address potential bottlenecks in the supply chain, the company proactively and strategically deepens cooperation and collaborative innovation mechanisms. With the accelerated evolution of high-end PCBs towards ultra-low loss resins, ultra-low profile copper foil (HVLP), and special high-performance fiberglass cloth, stringent process barriers and yield bottlenecks have led to temporary capacity constraints and tight supply of some high-end raw materials. The company fully intervenes in the very early stages of end-customer product development, participating in the electrical performance verification and reliability testing of next-generation high-end materials in advance, shortening the material certification cycle, and ensuring priority quota guarantees during periods of supply shortage; at the same time, it fully implements strategic safety stockpiles of key materials and accelerates diversified and localized certifications to reduce the risk of raw material supply disruptions and strengthen a resilient supply chain security barrier. (Cailian Press)