Fudan Microelectronics: FPAI chip completes tape-out testing and is ready for productization

Mars Finance reported on April 2nd that Fudan Microelectronics released an investor relations activity record, disclosing that its FPAI chip has built a heterogeneous integrated intelligent chip design and application development software platform, and is deploying a product series ranging from 4TOPS to 128TOPS. The first 32TOPS computing power chip is progressing well, while the 8TOPS and 128TOPS computing power chips have completed tape-out and testing, and are preparing for productization. The company's FPAI chip manufacturing processes cover 1xnm FinFET advanced and mature processes, integrating SoC, FPGA, and NPU into one unit, targeting customized edge and converged inference applications. In addition, the company launched RF-FPGA and RFSOC series products, integrating RFADDA technology at the 1xnm node. In 2025, the FPGA product line achieved sales revenue of approximately RMB 1.316 billion, with the high-reliability field contributing approximately RMB 1.2 billion in sales. The company's first-quarter operating performance was good, maintaining a steady year-on-year growth trend, and new businesses and new customers are actively expanding. (Company Announcement)