Qin Lihong: High memory bandwidth, real computing power, efficient collaboration, and stable mass production are the four core standards for measuring advanced automotive chips.

According to Mars Finance, NIO executive Li Hong recently provided a comprehensive explanation of the Dimensity NX9031 intelligent driving chip, directly addressing the industry's problems of inflated specifications and misleading marketing. He redefined the core evaluation criteria for high-end advanced automotive chips, breaking away from the industry's one-sided focus on computing power. In the current era of AI-powered intelligent driving, the chip's comprehensive scheduling capabilities are far more important than its theoretical computing power. High memory bandwidth, real computing power, efficient collaboration, and stable mass production are the four core standards for advanced automotive chips. Addressing the industry's prevalence of vague concepts regarding sparse and dense computing power, and the widespread inflated computing power figures (3-6 times), NIO insists on core self-developed technology, rejects superficial marketing, and refuses to mislead users with incomplete specifications. In terms of performance, the Dimensity NX9031 boasts an ultra-high bandwidth of 546GB/s, laying a solid foundation for performance, completely avoiding data congestion, and allowing the chip's performance to be fully unleashed, significantly outperforming most self-developed products in the industry. Simultaneously, the chip is equipped with a top-tier ISP image sensor, providing excellent low-light perception capabilities and underlying support for accurate road condition recognition in intelligent driving. In the field of multi-chip collaboration, this chip achieves millisecond-level seamless switching between dual chips, with industry-leading linkage efficiency. In mass production, the 5nm process Shenji NX9031 has been installed in over 250,000 vehicles, having undergone extensive real-world road testing. NIO, with its solid hardware specifications, collaborative technology, and mass production capabilities, has set a new industry benchmark for automotive intelligent chips.