Advanced Silicon Technology: Acquires 60% Stake in Anhui Jinglong Semiconductor
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Anbotong invests in a semiconductor equipment remanufacturing joint venture; its actual controller simultaneously acquires a controlling stake in lithography machine manufacturer ABM Asia.
According to Mars Finance, Anbotong (688168) recently announced its plan to invest 10.2 million yuan to establish a joint venture, "Botong Gangke," holding a 51% stake. The joint venture will primarily engage in the remanufacturing of mature process semiconductor equipment and related components. Notably, this investment is backed by a package of transactions—Anbotong's actual controller, Zhong Zhu, plans to acquire a 30% stake in the partner, Shenglin Gangke, and become a director. Upon completion of the transaction, he will indirectly hold a 24% stake in ABM Asia, a global manufacturer of lithography equipment. ABM has been deeply involved in the semiconductor lithography equipment field for over 20 years, possessing proprietary technologies for over 2,000 key components. It has delivered nearly 1,000 units to over 300 customers worldwide, and its lithography machine mass production project is scheduled to be located in Foshan, Guangdong in 2025. Anbotong also highlighted the risks associated with cross-industry integration in its announcement. (Cailian Press)
Semiconductor equipment sector rebounds after fluctuations; Zhengfan Technology rises over 10%.
Mars Finance reports that the semiconductor equipment sector rebounded during trading, with Zhengfan Technology surging over 10%, and Xianfeng Precision Technology, Xinyuan Microelectronics, Huafeng Measurement & Control, Jingyi Equipment, and Zhongke Feice all rising over 6%. On the news front, lithography machine giant ASML announced an upward revision of its full-year revenue guidance, primarily due to continued growth in demand for advanced lithography equipment related to AI chip manufacturing. The World Semiconductor Trade Statistics' spring 2026 forecast shows that the global semiconductor market size will reach $1.51 trillion in 2026, representing a year-on-year growth of nearly 90%. (Cailian Press)
Advanced packaging concept stocks rebounded after fluctuations; Huatian Technology surged to its daily limit.
Mars Finance reports that advanced packaging concept stocks rebounded after a period of fluctuation, with Huatian Technology hitting the daily limit, followed by gains in Dagang Shares, Yongxi Electronics, Changjiang Electronics Technology, Tongfu Microelectronics, Shenzhen Technology, and Jingfang Technology. In related news, He Tingbo, head of Huawei's semiconductor division, released version V2 of "Time Miniaturization Theory for Multi-Level Electronic Systems" ("Tao's Law") on July 3rd, clarifying five key technologies for implementation: LogicFolding unit-level 3D stacking, hybrid bonding, TSV, unified bus, and Hi-ONE optical engine. (Cailian Press)
Semiconductor silicon wafer concept stocks continued to strengthen, with GRINM Silicon hitting the 20% daily limit.
According to Mars Finance, the semiconductor silicon wafer concept stocks continued to strengthen, with GRINM Silicon hitting the 20cm daily limit, Shanghai Hejing rising nearly 10%, and Shanghai Silicon Industry, TCL Zhonghuan, Lianyong Microelectronics, and Zhongjing Technology following suit. In terms of news, a research report from Caitong Securities pointed out that in mid-May this year, global silicon wafer leaders Shin-Etsu Chemical, SUMCO, and GlobalWafers initiated their second round of price increases this year. The price of 12-inch conventional silicon wafers increased by 5% to 8%, while high-end special-purpose silicon wafers adapted for AI/HPC scenarios saw increases of 18% to 22%. The cumulative increase from the two rounds of price increases this year exceeds 15%. (Cailian Press)
Advanced packaging concept continues to rebound; Qipai Technology hits 20% daily limit.
Mars Finance reports that the advanced packaging concept stocks continued to rebound during trading, with Qipai Technology hitting the 20% daily limit, Yongxi Electronics rising over 10%, and Weiteou, Galaxy Microelectronics, Sanjia Technology, Weice Technology, and Qizhong Technology following suit. In related news, according to MoneyDJ, ASE Technology Holding Co., Ltd., a leading global outsourced semiconductor packaging and testing (OSAT) supplier, has again adjusted its packaging prices, with increases exceeding 20%. This price increase covers various advanced packaging technologies, including wafer-on-chip (CoWoS) and fan-out wafer-on-chip (FoCoS), affecting major US customers as well. (Cailian Press)
Semiconductor equipment stocks rebounded after a period of volatility, with Lianlian Technology and Huafeng Measurement & Control both rising by more than 10%.
Mars Finance reported on July 8th that semiconductor equipment stocks rebounded after a period of fluctuation, with Liandong Technology and Huafeng Measurement & Control both rising by over 10%, followed by Zhongke Feice, Shengmei Shanghai, and Fuchuang Precision. In related news, Liandong Technology released its 2026 semi-annual performance forecast, projecting net profit attributable to shareholders of the parent company to be between 21 million and 29 million yuan, representing a year-on-year increase of 73.39% to 139.44%; and projecting net profit excluding non-recurring items to be between 16.1 million and 24.1 million yuan, representing a year-on-year increase of 121.55% to 231.64%. (Science and Technology Treasure Broadcast)